टाँका

right|thumb|300px|६०-४० सोल्डर का तार टाँका या सोल्डर (Solder) एक गलनीय मिश्रधातु है। इसका उपयोग टाँका लगाने तथा धातु के टुकड़ों को जोड़ने के काम आती है। विभिन्न प्रकार के सोल्डर अगस्त 2014 संरचना गलनांक °CS/L विषैलापन गलनक्रांतिक टिप्पणी Sn Pb Ag Cu Sb Bi In Zn Cd Au अन्य. Sn50Zn49Cu1 200/300 no Galvanite Lead free galvanizing solder formulation designed specifically for high quality repairs to galvanized Steel surfaces. Simple, effective and easy to use, in both manufacturing and field applications. Metallurgically bonds to the Steel, for a seamless protective barrier.Kapp Alloy Galvanite http://www.kappalloy.com/galvanite-solder.php 23 अक्टूबर 2012 https://www.webcitation.org/6I307lWc2?url=http://www.kappalloy.com/galvanite-solder.php 12 जुलाई 2013 dead 50 1 49 Sn90Zn7Cu3 200/222 no Kapp Eco-Babbitt Commonly used in capacitor manufacturing as protective coating to shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor, to prevent current and charge leakage out of and within the layers of the capacitor, and to prevent the development of electron flows within the coating material itself, that would dimminish capacitor performance, coating, and capacitor life.Kapp Alloy Kapp Eco Babbitt http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=54254&component=catalog&catalog_id=18662 4 अप्रैल 2013 https://www.webcitation.org/6I308SVke?url=http://www.smtnet.com/company/index.cfm?fuseaction=view_company 12 जुलाई 2013 dead 90 3 7 Pb90Sn10 268/302 275/302http://www.smarttec.de/download/Legierungs-Info.pdf Alloy information 19 जुलाई 2011 https://web.archive.org/web/20110719084027/http://www.smarttec.de/download/Legierungs-Info.pdf 19 जुलाई 2011 dead Pb no Sn10, UNS L54520, ASTM10B. Balls for CBGA components, replaced by Sn95.5Ag3.9Cu0.6. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.SOLDER ALLOYS Selection Chart https://web.archive.org/web/20110711170815/http://www.hirschmetals.com/pdfs/SolderAlloyChart.pdf 11 जुलाई 2011 . (PDF) . Retrieved on 2010-07-06. Has low thermal EMF, can be used as an alternative to Cd70 where parasitic thermocouple voltage has to be avoided.http://www.analog.com/library/analogDialogue/archives/39-05/Web_Ch4_final.pdf संग्रहीत प्रति 16 अगस्त 2014 https://www.webcitation.org/6I309oqNH?url=http://www.analog.com/library/analogDialogue/archives/39-05/Web_Ch4_final.pdf 12 जुलाई 2013 dead 10 90 Pb88Sn12 254/296 Pb no Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder. 12 88 Pb85Sn15 227/288 Pb no Used for coating tubes and sheets and fabrication of car radiators. Body solder. 15 85 Pb80Sn20 183/280 Pb no Sn20, UNS L54711. Used for coating radiator tubes for joining fins. 20 80 Pb75Sn25 183/266 Pb no Crude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder. 25 75 Pb70Sn30 185/255 183/257 Pb no Sn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder. 30 70 Pb68Sn32 253 Pb no "Plumber solder", for construction plumbing workshttp://books.google.com/?id=1ZOXXV9LdcwC&pg=PA378 Manufacturing Processes PHI Learning Pvt. Ltd. 378 Kaushish 81-203-3352-7 2008 32 68 Pb68Sn30Sb2 185/243 Pb no Pb68 30 68 2 Sn30Pb50Zn20 177/288 Pb no Kapp GalvRepair Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been the used for cast Iron and galvanized surface repair.Kapp Alloy GalvRepair Kapp GalvRepair http://www.kappalloy.com/tin-zinc-lead-solder.php Kapp Alloy & Wire, Inc. 23 अक्टूबर 2012 https://www.webcitation.org/6I30APcTi?url=http://www.kappalloy.com/tin-zinc-lead-solder.php 12 जुलाई 2013 dead 30 50 20 Sn33Pb40Zn28 230/275 Pb no Economical solder for repairing & joining most metals including Aluminum and cast Iron. Have been the used for cast Iron and galvanized surface repair. 33 40 28 Pb67Sn33 187–230 Pb no PM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additives 33 67 Pb65Sn35 183/250 Pb no Sn35. Used as a cheaper alternative of Sn60Pb40 for wiping and sweating joints. 35 65 Pb60Sn40 183/238 183/247 Pb no Sn40, UNS L54915. For soldering of brass and car radiators. For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems. 40 60 Pb55Sn45 183/227 Pb no For soldering radiator cores, roof seams, and for decorative joints. 45 55 Sn50Pb50 183/216 183–212 Pb no Sn50, UNS L55030. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below −150 °C. Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those. For wiping and assembling plumbing joints for non-potable water. 50 50 Sn50Pb48.5Cu1.5 183/2153439-00-577-7594 Solder, Tin Alloy. Tpub.com. Retrieved on 2010-07-06. Pb no Savbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. 50 48.5 1.5 Sn60Pb40 183/190 183/188 Pb near Sn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Slightly cheaper than Sn63Pb37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn63Pb37.msl747.PDF https://web.archive.org/web/20150319035919/http://www.farnell.com/datasheets/315929.pdf 19 मार्च 2015 . (PDF) . Retrieved on 2010-07-06. 60 40 Sn60Pb38Cu2 183/190 Pb Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. 60 38 2 Sn60Pb39Cu1 Pb no 60 39 1 Sn62Pb38 183 Pb near "Tinman's solder", used for tinplate fabrication work. 62 38 Sn63Pb37 183http://www.balverzinn.com/solder-Sn63Pb37.html?file=tl_files%2Fbalverzinn%2Fdownloads%2Fdatenblaetter_en%2FSolder%20Sn63Pb37.pdf Balver Zinn Solder Sn63Pb37 14 जून 2020 https://web.archive.org/web/20190306111505/https://www.balverzinn.com/solder-Sn63Pb37.html?file=tl_files%2Fbalverzinn%2Fdownloads%2Fdatenblaetter_en%2FSolder%20Sn63Pb37.pdf 6 मार्च 2019 dead Pb yes Sn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those. Sn60Pb40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn60Pb40. 63 37 Sn63Pb37P0.0015–0.04 183http://www.balverzinn.com/downloads/Solder_Sn63PbP.pdf Balver Zinn Solder Sn63PbP 7 जुलाई 2011 https://web.archive.org/web/20110707210112/http://www.balverzinn.com/downloads/Solder_Sn63PbP.pdf 7 जुलाई 2011 dead Pb yes Sn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam. 63 37 P Sn62Pb37Cu1 183Pajky_vkladanylist_Cze_ang_2010.indd https://web.archive.org/web/20140928114113/http://www.kovopb.cz/userdata/pages/12/dp-solders_pb.pdf 28 सितंबर 2014 . (PDF) . Retrieved on 2010-07-06. Pb yes Similar to Sn63Pb37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder. 62 37 1 Sn70Pb30 183/193 Pb no Sn70 70 30 Sn90Pb10 183/213 Pb no formerly used for joints in food industry 90 10 Sn95Pb5 238 Pb no plumbing and heating 95 5 Pb92Sn5.5Ag2.5 286/301 Pb no For higher-temperature applications. 5.5 92 2.5 Pb80Sn12Sb8 Pb no Used for soldering iron and steel 12 80 8 Pb80Sn18Ag2 252/260 Pb no Used for soldering iron and steel 18 80 2 Pb79Sn20Sb1 184/270 Pb no Sb1 20 79 1 Pb55Sn43.5Sb1.5 Pb no General purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals. 43.5 55 1.5 Sn43Pb43Bi14 144/163 Pb no Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. Useful for step soldering. 43 43 14 Sn46Pb46Bi8 120/167 Pb no Bi8 46 46 8 Bi52Pb32Sn16 96 Pb yes? Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.http://books.google.com/?id=vMpHHWboSAAC&pg=PA178 Solder joint reliability: theory and applications Springer 178 John H. Lau 0-442-00260-2 1991जनवरी 2023 InternetArchiveBot 16 32 52 Bi46Sn34Pb20 100/105 Pb no Bi46 34 20 46 Sn62Pb36Ag2 179 Pb yes Sn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics.http://books.google.com/?id=MvSMg5HC1YcC&pg=PA164 Solders and soldering: materials, design, production, and analysis for reliable bonding McGraw-Hill Professional 164 Howard H. Manko 0-07-134417-9 2001 Not recommended for gold. General-purpose. 62 36 2 Sn62.5Pb36Ag2.5 179 Pb yes 62.5 36 2.5 Pb88Sn10Ag2 268/290 267/299http://www.matweb.com/search/DataSheet.aspx?MatGUID=5ef2e290b637430483aab758ac193f3c Indalloy 228 Pb-Sn-Ag Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819102756/http://www.matweb.com/search/DataSheet.aspx?MatGUID=5ef2e290b637430483aab758ac193f3c 19 अगस्त 2014 dead Pb no Sn10, Pb88. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold. Forms a eutectic phase, not recommended for operation above 120 °C. 10 88 2 Pb90Sn5Ag5 292 Pb yes 5 90 5 Pb92.5Sn5Ag2.5 287/296 299/304 Pb no Pb93. 5 92.5 2.5 Pb93.5Sn5Ag1.5 296/301 305/306 Pb no Pb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb95Sn5. 5 93.5 1.5 Pb95.5Sn2Ag2.5 299/304 Pb no 2 95.5 2.5 In97Ag3 143http://www.matweb.com/search/DataSheet.aspx?MatGUID=a8d11bdcc82c4410af96f5d43579d420 Indium Corp. Indalloy 290 In-Ag Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819154234/http://www.matweb.com/search/datasheet.aspx?MatGUID=a8d11bdcc82c4410af96f5d43579d420 19 अगस्त 2014 dead – yes Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices. 3 97 In90Ag10 143/237http://www.matweb.com/search/DataSheet.aspx?MatGUID=08d1a1dea82b4e13ac90e38eecb0b919 Indalloy 3 In-Ag Solder Alloy 16 अगस्त 2014 http://arquivo.pt/wayback/20160515084633/http%3A//www.matweb.com/search/DataSheet.aspx?MatGUID%3D08d1a1dea82b4e13ac90e38eecb0b919 15 मई 2016 dead – no Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics. 10 90 In75Pb25 156/165 Pb no Less gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures. 25 75 In70Pb30 160/174 165/175http://www.matweb.com/search/DataSheet.aspx?MatGUID=afcc8e122d334379a6d0d7d7079fc54d Indalloy 204 In-Pb Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819082939/http://www.matweb.com/search/DataSheet.aspx?MatGUID=afcc8e122d334379a6d0d7d7079fc54d 19 अगस्त 2014 dead Pb no In70. Suitable for gold, low gold-leaching. Good thermal fatigue properties. 30 70 In60Pb40 174/185 173/181 Pb no In60. Low gold-leaching. Good thermal fatigue properties. 40 60 In50Pb50 180/209 178/210 Pb no In50. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure. On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. Less gold dissolution and more ductile than lead-tin alloys. Good thermal fatigue properties. 50 50 In50Sn50 118/125http://www.matweb.com/search/DataSheet.aspx?MatGUID=718dfcb678cc42359978349a905862bc Indalloy 1 Indium-Tin Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083355/http://www.matweb.com/search/DataSheet.aspx?MatGUID=718dfcb678cc42359978349a905862bc 19 अगस्त 2014 dead – no Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder. 50 50 In70Sn15Pb9.6Cd5.4 125http://www.matweb.com/search/DataSheet.aspx?MatGUID=802ee7cd28ef4fd59cdc87d7e1fef98b Indalloy 13 Indium Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084212/http://www.matweb.com/search/DataSheet.aspx?MatGUID=802ee7cd28ef4fd59cdc87d7e1fef98b 19 अगस्त 2014 dead Pb,Cd 15 9.6 70 5.4 Pb75In25 250/264 240/260http://www.matweb.com/search/DataSheet.aspx?MatGUID=3cc5ca3fdb7848bda630047dd05bb6b3 Indalloy 10 Pb-In Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819102852/http://www.matweb.com/search/DataSheet.aspx?MatGUID=3cc5ca3fdb7848bda630047dd05bb6b3 19 अगस्त 2014 dead Pb no In25. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.http://books.google.com/?id=c2YxCCaM9RIC&pg=PA758 Electronic Materials Handbook: Packaging 758 Merrill L. Minges ASM International 1989 0-87170-285-1 Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.http://books.google.com/?id=IcxDPA2U6esC&pg=PA385 Surface mount technology: principles and practice 385 Ray P. Prasad Springer 1997 0-412-12921-3 75 25 Sn70Pb18In12 162154/167http://www.matweb.com/search/DataSheet.aspx?MatGUID=5edfeb10d3c74d44967d0d605328c1e8 Indalloy 9 Sn-Pb-In Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819085138/http://www.matweb.com/search/DataSheet.aspx?MatGUID=5edfeb10d3c74d44967d0d605328c1e8 19 अगस्त 2014 dead Pb yes General purpose. Good physical properties. 70 18 12 Sn37.5Pb37.5In25 134/181 Pb no Good wettability. Not recommended for gold. 37.5 37.5 25 Pb90In5Ag5 290/310 Pb no 90 5 5 Pb92.5In5Ag2.5 300/310 Pb no UNS L51510. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used.. 92.5 2.5 5 Pb92.5In5Au2.5 300/310 Pb no In5 92.5 5 2.5 Pb94.5Ag5.5 305/364 304/343http://www.matweb.com/search/DataSheet.aspx?MatGUID=0225ffa15e7e4a87a61bf164dc0f77e1 94.5Pb-5.5Ag Lead-Silver Solder, ASTM Class 5.5S; UNS L50180 16 अगस्त 2014 https://web.archive.org/web/20140819084752/http://www.matweb.com/search/DataSheet.aspx?MatGUID=0225ffa15e7e4a87a61bf164dc0f77e1 19 अगस्त 2014 dead Pb no Ag5.5, UNS L50180 94.5 5.5 Pb95Ag5 305/364http://www.matweb.com/search/DataSheet.aspx?MatGUID=7a0646b6fbce4f79b2cee716edc3f66f Indalloy 175 Lead Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084010/http://www.matweb.com/search/DataSheet.aspx?MatGUID=7a0646b6fbce4f79b2cee716edc3f66f 19 अगस्त 2014 dead Pb no 95 5 Pb97.5Ag2.5 303 304 304/579http://www.matweb.com/search/DataSheet.aspx?MatGUID=299122b40d9246bfa960a15e875d1464 97.5Pb-2.5Ag Lead-Silver Solder, ASTM Class 2.5S UNS L50132 16 अगस्त 2014 https://web.archive.org/web/20140819084204/http://www.matweb.com/search/DataSheet.aspx?MatGUID=299122b40d9246bfa960a15e875d1464 19 अगस्त 2014 dead Pb yes no Ag2.5, UNS L50132. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints.http://books.google.com/?id=gW6zNhhy5ZQC&pg=PA114 Symposium on Solder 114 ASTM International 1957 Torch solder. 97.5 2.5 Sn97.5Pb1Ag1.5 305 Pb yes Important for hybrid circuits assembly. 97.5 1 1.5 Pb97.5Ag1.5Sn1 309 Pb yes Ag1.5, ASTM1.5S. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable. Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold. Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures. 1 97.5 1.5 Pb54Sn45Ag1 177–210 Pb exceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel 45 54 1 Pb96Ag4 305 Pb high-temperature jointshttp://books.google.com/?id=M5BWtQ-xjeUC&pg=PA445 Engineering design: a practical guide Trafford Publishing 445 Madara Ogot, Gul Okudan-Kremer 1-4120-3850-2 2004 96 4 Pb96Sn2Ag2 252/295 Pb Pb96 2 96 2 Sn61Pb36Ag3 Pb 61 36 3 Sn56Pb39Ag5 Pb 56 39 5 Sn98Ag2 – 98 2 Sn65Ag25Sb10 233 – yes Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder. 65 25 10 Sn96.5Ag3.0Cu0.5 217/220 217/218http://www.balverzinn.com/tl_files/balverzinn/downloads/datenblaetter_en/Solder%20SN97C.pdf Balver Zinn Solder SN97C (SnAg3.0Cu0.5) 16 अगस्त 2014 https://web.archive.org/web/20121224043938/http://www.balverzinn.com/tl_files/balverzinn/downloads/datenblaetter_en/Solder%20SN97C.pdf 24 दिसंबर 2012 dead – near SAC305. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn97Ag3 alloy. Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 96.5 3 0.5 Sn95.8Ag3.5Cu0.7 217–218 – near SN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.5Ag3.5 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 95.8 3.5 0.7 Sn95.6Ag3.5Cu0.9 217 – yes Determined by NIST to be truly eutectic. 95.6 3.5 0.9 Sn95.5Ag3.8Cu0.7 217http://www.balverzinn.com/downloads/Solder_SN96C.pdf Balver Zinn Solder SN96C (SnAg3,8Cu0,7) 7 जुलाई 2011 https://web.archive.org/web/20110707210219/http://www.balverzinn.com/downloads/Solder_SN96C.pdf 7 जुलाई 2011 dead – almost SN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 95.5 3.8 0.7 Sn95.25Ag3.8Cu0.7Sb0.25 – Preferred by the European IDEALS consortium for wave soldering. 95.25 3.8 0.7 0.25 Sn95.5Ag3.9Cu0.6 217http://www.matweb.com/search/DataSheet.aspx?MatGUID=a811b22a9ddd406d88a92130ebc9a9f0 Indalloy 252 95.5Sn/3.9Ag/0.6Cu Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819102822/http://www.matweb.com/search/DataSheet.aspx?MatGUID=a811b22a9ddd406d88a92130ebc9a9f0 19 अगस्त 2014 dead – yes Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn10Pb90. Solder paste for rework of BGA boards. Alloy of choice for general SMT assembly. 95.5 3.9 0.6 Sn95.5Ag4Cu0.5 217http://www.matweb.com/search/DataSheet.aspx?MatGUID=19662ece2a4a4bb2bbe7aa522f916185 Indalloy 246 95.5Sn/4.0Ag/0.5Cu Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084013/http://www.matweb.com/search/DataSheet.aspx?MatGUID=19662ece2a4a4bb2bbe7aa522f916185 19 अगस्त 2014 dead – yes Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications.Kapp Alloy KappFree http://www.kappalloy.com/kappfree-elec-solder.php Kapp Alloy & Wire, Inc. 25 अक्टूबर 2012 https://www.webcitation.org/6I93a1ZvZ?url=http://www.kappalloy.com/kappfree-elec-solder.php 16 जुलाई 2013 dead 95.5 4 0.5 Sn96.5Ag3.5 221 – yes Sn96, Sn96.5, 96S. Fine lamellar structure of densely distributed Ag3Sn. Annealing at 125 °C coarsens the structure and softens the solder. Creeps via dislocation climb as a result of lattice diffusion. Used as wire for hand soldering rework; compatible with SnCu0.7, SnAg3Cu0.5, SnAg3.9Cu0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry.Ganesan and Pecht p. 110 Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations. High tin content allows absorbing significant amount of gold without embrittlement.http://www.aimsolder.com/techarticles/Solder+Selection+for+Photonic+Packaging.pdf Solder selection for photonic packaging 3 अप्रैल 2007 https://web.archive.org/web/20070403155343/http://www.aimsolder.com/techarticles/Solder+Selection+for+Photonic+Packaging.pdf 3 अप्रैल 2007 dead 96.5 3.5 Sn96Ag4 221–229 – no ASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. 96 4 Sn95Ag5 221/254Kapp Alloy KappZapp http://www.kappalloy.com/zapp-solder.php Kapp Alloy & Wire, Inc. 25 अक्टूबर 2012 https://www.webcitation.org/6I93airS6?url=http://www.kappalloy.com/zapp-solder.php 16 जुलाई 2013 dead – no Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold. Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless. 95 5 Sn94Ag6 221/279 – no Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 30,000 psi on Stainless. 94 6 Sn93Ag7 221/302 – no Produces strong and ductile joints on Copper and Stainless Steel. The resulting joints have high tolerance to vibration and stress, with tensile strengths to 31,000 psi on Stainless. Audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance.SolderDirect KappZapp7 http://www.solderdirect.com/all-products/non-aluminum-soldering/kappzapp/kappzapp7tm.html SolderDirect.com 25 अक्टूबर 2012 https://www.webcitation.org/6I93bMZnt?url=http://www.solderdirect.com/all-products/non-aluminum-soldering/kappzapp/kappzapp7tm.html 16 जुलाई 2013 dead 93 7 Sn95Ag4Cu1 – 95 4 1 Sn 232 – pure Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying. Susceptible to tin pest. 99.99 Sn99.3Cu0.7 227 – yes Sn99Cu1. Also designated as Sn99Cu1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu6Sn5.Ganesan and Pecht p. 404 Forms large dendritic ß-tin crystals in a network of eutectic microstructure with finely dispersed Cu6Sn5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest. Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modified or nickel stabilized.http://www.aimsolder.com/pdf/The+Fluidity+of+the+Ni-Modified+Sn-Cu+Eutectic+Lead+Free+Solder.pdf The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder 16 अक्तूबर 2006 https://web.archive.org/web/20061016044946/http://www.aimsolder.com/pdf/The+Fluidity+of+the+Ni-Modified+Sn-Cu+Eutectic+Lead+Free+Solder.pdf 16 अक्तूबर 2006 dead 99.3 0.7 (Ni) Sn99Cu0.7Ag0.3 217/228http://www.balverzinn.com/downloads/Solder_SCA.pdf Balver Zinn Solder SCA (SnCu0.7Ag0.3) 7 जुलाई 2011 https://web.archive.org/web/20110707210235/http://www.balverzinn.com/downloads/Solder_SCA.pdf 7 जुलाई 2011 dead – no SCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. 99 0.3 0.7 Sn97Cu3 227/250http://www.balverzinn.com/downloads/Solder_Sn97Cu3.pdf Balver Zinn Solder Sn97Cu3 7 जुलाई 2011 https://web.archive.org/web/20110707210148/http://www.balverzinn.com/downloads/Solder_Sn97Cu3.pdf 7 जुलाई 2011 dead 232/332 – For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing. 97 3 Sn97Cu2.75Ag0.25 228/314 – High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors. 97 0.25 2.75 Zn100 419 – pure For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.Howard H. Manko Solders and soldering: materials, design, production, and analysis for reliable bonding http://books.google.com/books?id=MvSMg5HC1YcC&pg=PA396 17 अप्रैल 2011 8 फ़रवरी 2001 McGraw-Hill Professional 978-0-07-134417-3 396– https://web.archive.org/web/20181123234718/https://books.google.com/books?id=MvSMg5HC1YcC&pg=PA396 23 नवंबर 2018 live 100 Bi100 271 – pure Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint. 100 Sn91Zn9 199 – yes KappAloy9 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Best solder for Aluminum wire to Copper busses or Copper wire to Aluminum busses or contacts.Kapp Alloy KappAloy http://www.kappalloy.com/tin-zinc-solder.php Kapp Alloy & Wire, Inc. 23 अक्टूबर 2012 https://www.webcitation.org/6I93cc5A6?url=http://www.kappalloy.com/tin-zinc-solder.php 16 जुलाई 2013 dead UNS#: L91090 91 9 Sn85Zn15 199/260 – no KappAloy15 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength. Lies between soft solder and silver brazing alloys, thereby avoiding damage to critical electronics and substrate deformation and segregation. Has a wide plastic range this makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. 85 15 Zn95Al5 382 – yes For soldering aluminium. Good wetting. 95 Al5 Sn91.8Bi4.8Ag3.4 211/213http://www.matweb.com/search/DataSheet.aspx?MatGUID=fbf7a599eb0e407981ed2f785bbe24ee Indalloy 249 91.8Sn/3.4Ag/4.8Bi Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084744/http://www.matweb.com/search/DataSheet.aspx?MatGUID=fbf7a599eb0e407981ed2f785bbe24ee 19 अगस्त 2014 dead – no Do not use on lead-containing metallizations. U.S. Patent 5,439,639 (ICA Licensed Sandia Patent). 91.8 3.4 4.8 Sn70Zn30 199/316 – no KappAloy30 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 70 30 Sn80Zn20 199/288 – no KappAloy20 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 80 20 Sn60Zn40 199/343 – no KappAloy40 For soldering of aluminium. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15Zn and 91Sn/9Zn. 60 40 Pb63Sn35Sb2 185/243 Pb no Sb2 35 63 2 Pb63Sn34Zn3 170/256 Pb no Poor wetting of aluminium. Poor corrosion rating. 34 63 3 Pb92Cd8 310? Pb,Cd ? For soldering aluminium. US patent 1,333,666.Composition And Physical Properties Of Alloys https://web.archive.org/web/20120426211236/http://www.csudh.edu/oliver/chemdata/alloys.htm 26 अप्रैल 2012 . Csudh.edu (2007-08-18). Retrieved on 2010-07-06. 92 8 Sn48Bi32Pb20 140/160 Pb no For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. 48 20 32 Sn89Zn8Bi3 191–198 – Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this. 89 3 8 Sn83.6Zn7.6In8.8 181/187http://www.matweb.com/search/DataSheet.aspx?MatGUID=64d8ba345b524cdc815a1df1dc7142b0 Indalloy 226 Tin Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083140/http://www.matweb.com/search/DataSheet.aspx?MatGUID=64d8ba345b524cdc815a1df1dc7142b0 19 अगस्त 2014 dead – no High dross due to zinc. Covered by U.S. Patent #5,242,658. 83.6 8.8 7.6 Sn86.5Zn5.5In4.5Bi3.5 174/186http://www.matweb.com/search/DataSheet.aspx?MatGUID=67e162f8c187441a85e22ea1b98b52a0 Indalloy 231 Sn-Zn-In-Bi Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084404/http://www.matweb.com/search/DataSheet.aspx?MatGUID=67e162f8c187441a85e22ea1b98b52a0 19 अगस्त 2014 dead – no Lead-free. Corrosion concerns and high drossing due to zinc content. 86.5 3.5 4.5 5.5 Sn86.9In10Ag3.1 204/205http://www.matweb.com/search/DataSheet.aspx?MatGUID=778b662660244af7b8d9689a007e8813 Indalloy 254 86.9Sn/10.0In/3.1Ag Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083128/http://www.matweb.com/search/DataSheet.aspx?MatGUID=778b662660244af7b8d9689a007e8813 19 अगस्त 2014 dead – Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. 86.9 3.1 10 Sn95Ag3.5Zn1Cu0.5 221L – no 95 3.5 0.5 1 Sn95Sb5 235/240 232/240 – no Sb5, ASTM95TA. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.http://books.google.com/?id=H75TywRXUK4C&pg=PA541 Handbook of lead-free solder technology for microelectronic assemblies CRC Press 541 Karl J. Puttlitz, Kathleen A. Stalter 0-8247-4870-0 2004 High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications. Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs. 95 5 Sn97Sb3 232/238http://www.matweb.com/search/DataSheet.aspx?MatGUID=fc88a689e7ab481194cc1c5a1e2eb6a1 Indalloy 131 97Sn/3Sb Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083132/http://www.matweb.com/search/DataSheet.aspx?MatGUID=fc88a689e7ab481194cc1c5a1e2eb6a1 19 अगस्त 2014 dead – no 97 3 Sn99Sb1 232/235http://www.matweb.com/search/DataSheet.aspx?MatGUID=6b43308933eb48bba5f38c1217c73ce3 Indalloy 129 99Sn/1Sb Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084208/http://www.matweb.com/search/DataSheet.aspx?MatGUID=6b43308933eb48bba5f38c1217c73ce3 19 अगस्त 2014 dead – no 99 1 Sn99Ag0.3Cu0.7 – 99 0.3 0.7 Sn96.2Ag2.5Cu0.8Sb0.5 217–225 217 – Ag03A. Patented by AIM alliance. 96.2 2.5 0.8 0.5 Sn88In8.0Ag3.5Bi0.5 197–208 – Patented by Matsushita/Panasonic. 88 3.5 0.5 8 Bi57Sn42Ag1 137/139 139/140http://www.matweb.com/search/DataSheet.aspx?MatGUID=3f9d5aa624ea454f81308048ab101817 Indalloy 282 57Bi/42Sn/1Ag Lead-Free Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083136/http://www.matweb.com/search/DataSheet.aspx?MatGUID=3f9d5aa624ea454f81308048ab101817 19 अगस्त 2014 dead – Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola. 42 1 57 Bi58Sn42 138 – yes Bi58. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. Low-temperature eutectic solder with high strength. Particularly strong, very brittle. Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.http://books.google.com/?id=H75TywRXUK4C&pg=PA21 Handbook of lead-free solder technology for microelectronic assemblies Karl J. Puttlitz, Kathleen A. Stalter CRC Press 2004 0-8247-4870-0 Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.http://www.matweb.com/search/DataSheet.aspx?MatGUID=967a4cd7871b46fa9128a29c303cf8be Indalloy 281 Bi-Sn Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819144407/http://www.matweb.com/search/datasheet.aspx?MatGUID=967a4cd7871b46fa9128a29c303cf8be 19 अगस्त 2014 dead Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification. 42 58 Bi58Pb42 124/126http://www.matweb.com/search/DataSheet.aspx?MatGUID=4c19e3682c3b4d3198f3025b81cce73f Indalloy 67 Bismuth-Lead Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819103018/http://www.matweb.com/search/DataSheet.aspx?MatGUID=4c19e3682c3b4d3198f3025b81cce73f 19 अगस्त 2014 dead Pb 42 58 In80Pb15Ag5 142/149149/154http://www.matweb.com/search/DataSheet.aspx?MatGUID=03e0734456b74c088b9f9c19f6af6ab9 Indalloy 2 In-Pb-Ag Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819085141/http://www.matweb.com/search/DataSheet.aspx?MatGUID=03e0734456b74c088b9f9c19f6af6ab9 19 अगस्त 2014 dead Pb no In80. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering. 15 5 80 Pb60In40 195/225 Pb no In40. Low gold-leaching. Good thermal fatigue properties. 60 40 Pb70In30 245/260 Pb no In30 70 30 Sn37.5Pb37.5In26 134/181 Pb no In26 37.5 37.5 26 Sn54Pb26In20 130/154 140/152http://www.matweb.com/search/DataSheet.aspx?MatGUID=fcd842de41fd4fcba9250418612914bf Indalloy 532 Tin Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819082932/http://www.matweb.com/search/DataSheet.aspx?MatGUID=fcd842de41fd4fcba9250418612914bf 19 अगस्त 2014 dead Pb no In20 54 26 20 Pb81In19 270/280 260/275http://www.matweb.com/search/DataSheet.aspx?MatGUID=d7525946b1a446afa73b5dd52997a283 Indalloy 150 Pb-In Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819103015/http://www.matweb.com/search/DataSheet.aspx?MatGUID=d7525946b1a446afa73b5dd52997a283 19 अगस्त 2014 dead Pb no In19. Low gold-leaching. Good thermal fatigue properties. 81 19 In52Sn48 118 – yes In52. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing. Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials. 48 52 Sn52In48 118/131 – no very low tensile strength 52 48 Sn58In42 118/145http://www.matweb.com/search/DataSheet.aspx?MatGUID=aea1c42aa0a341aa948d7103c3a4564b Indalloy 87 Indium-Tin Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819103044/http://www.matweb.com/search/DataSheet.aspx?MatGUID=aea1c42aa0a341aa948d7103c3a4564b 19 अगस्त 2014 dead – no 58 42 Sn51.2Pb30.6Cd18.2 145http://www.matweb.com/search/DataSheet.aspx?MatGUID=199da4a304e44104868eaf537a7c9a16 Indalloy 181 Sn-Pb-Cd Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083605/http://www.matweb.com/search/DataSheet.aspx?MatGUID=199da4a304e44104868eaf537a7c9a16 19 अगस्त 2014 dead Pb,Cd yes General-purpose. Maintains creep strength well. Unsuitable for gold. 51.2 30.6 18.2 Sn77.2In20Ag2.8 175/187http://www.matweb.com/search/DataSheet.aspx?MatGUID=e2f902d610494ab7a7f500fcfbdb43cc Indalloy 227 Sn-In-Ag Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084940/http://www.matweb.com/search/DataSheet.aspx?MatGUID=e2f902d610494ab7a7f500fcfbdb43cc 19 अगस्त 2014 dead – no Similar mechanical properties with Sn63Pb37, Sn62Pb36Ag2 and Sn60Pb40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. 77.2 2.8 20 In74Cd26 123http://www.matweb.com/search/DataSheet.aspx?MatGUID=1fef3a2158ba400abe6f7e2a5c171ca1 Indalloy 253 Indium Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819103041/http://www.matweb.com/search/DataSheet.aspx?MatGUID=1fef3a2158ba400abe6f7e2a5c171ca1 19 अगस्त 2014 dead Cd yes 74 26 In61.7Bi30.8Cd7.5 62http://www.matweb.com/search/DataSheet.aspx?MatGUID=4ccb81db2b7e4eb5a517409445b37deb Indalloy 18 Indium Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819102759/http://www.matweb.com/search/DataSheet.aspx?MatGUID=4ccb81db2b7e4eb5a517409445b37deb 19 अगस्त 2014 dead Cd yes 30.8 61.7 7.5 Bi47.5Pb25.4Sn12.6Cd9.5In5 57/65http://www.matweb.com/search/DataSheet.aspx?MatGUID=61beeec304154e14b711984757f073ed Indalloy 140 Bismuth Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083601/http://www.matweb.com/search/DataSheet.aspx?MatGUID=61beeec304154e14b711984757f073ed 19 अगस्त 2014 dead Pb,Cd no 12.6 25.4 47.5 5 9.5 Bi48Pb25.4Sn12.8Cd9.6In4 61/65http://www.matweb.com/search/DataSheet.aspx?MatGUID=bf336aff588c4e72acb714d5a4ae13c6 Indalloy 147 Bismuth Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819103020/http://www.matweb.com/search/DataSheet.aspx?MatGUID=bf336aff588c4e72acb714d5a4ae13c6 19 अगस्त 2014 dead Pb,Cd no 12.8 25.4 48 9.6 Bi49Pb18Sn15In18 58/69http://www.matweb.com/search/DataSheet.aspx?MatGUID=5a48bcea477c4b2eb9153f5fc28243da Indalloy 21 Bismuth Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819082717/http://www.matweb.com/search/DataSheet.aspx?MatGUID=5a48bcea477c4b2eb9153f5fc28243da 19 अगस्त 2014 dead Pb no 15 18 49 18 Bi49Pb18Sn12In21 58 Pb yes Cerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics. 12 18 49 21 Bi50.5Pb27.8Sn12.4Cd9.3 70/73http://www.matweb.com/search/DataSheet.aspx?MatGUID=82d47484509e4e81b53f487bed41a324 Indalloy 22 Bismuth Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819084748/http://www.matweb.com/search/DataSheet.aspx?MatGUID=82d47484509e4e81b53f487bed41a324 19 अगस्त 2014 dead Pb,Cd no 12.4 27.8 50.5 9.3 Bi50Pb26.7Sn13.3Cd10 70 Pb,Cd yes Cerrobend. Used in low-temperature physics as a solder. 13.3 26.7 50 10 Bi44.7Pb22.6In19.1Cd5.3Sn8.3 47 Cd,Pb yes Cerrolow 117. Used as a solder in low-temperature physics. 8.3 22.6 44.7 19.1 5.3 In60Sn40 113/122 – no 40 60 In51.0Bi32.5Sn16.5 60.5 – yes Field's metal 16.5 32.5 51 Bi49.5Pb27.3Sn13.1Cd10.1 70.9 Pb,Cd yes Lipowitz Metal 13.1 27.3 49.5 10.1 Bi50.0Pb25.0Sn12.5Cd12.5 71 Pb,Cd yes Wood's metal, mostly used for casting. 12.5 25 50 12.5 Bi50.0Pb31.2Sn18.8 97 Pb no Newton's metal 18.8 31.2 50 Bi50Pb28Sn22 109 Pb no Rose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling. 22 28 50 Cd95Ag5 338/393Kapp Alloy KappTec http://www.kappalloy.com/tec-solder.php Kapp Alloy & Wire, Inc. 23 अक्टूबर 2012 https://www.webcitation.org/6I93dGwEA?url=http://www.kappalloy.com/tec-solder.php 16 जुलाई 2013 dead Cd no KappTec General purpose solder that will join all solderable metals except Aluminum. High temperature, high strength solder. It is used in applications where alloys melting higher than soft solders are required, but the cost and strength of Silver-brazing alloys is not necessary. 5 95 Cd82.5Zn17.5 265Kapp Alloy Kapp Cad/Zinc http://www.kappalloy.com/cad-zinc-solder.php Kapp Alloy & Wire, Inc 23 अक्टूबर 2012 https://www.webcitation.org/6I93e80dd?url=http://www.kappalloy.com/cad-zinc-solder.php 16 जुलाई 2013 dead Cd yes Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Also for soldering aluminium and die-cast zinc alloys. Used in cryogenic physics for ataching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.Guy Kendall White Philip J. Meeson Experimental techniques in low-temperature physics http://books.google.com/books?id=xO0xMe7JvOsC&pg=PA207 14 मई 2011 2002 Clarendon 978-0-19-851428-2 207– 17.5 82.5 Cd70Zn30 265/300 Cd no Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products. 30 70 Cd60Zn40 265/316 Cd no Medium temperature alloy that provide strong, corrosion-resistant joints on most metals. Works especially well on Aluminum-to-Aluminum and Aluminum-to-Copper joints, with excellent corrosion resistance and superior strength in high vibration and high stress applications in electronics, lighting and electrical products. 40 60 Cd78Zn17Ag5 249/316Kapp Alloy KappTecZ http://www.kappalloy.com/tecz-solder.php Kapp Alloy & Wire, Inc. 25 अक्टूबर 2012 https://www.webcitation.org/6I93eldGn?url=http://www.kappalloy.com/tecz-solder.php 16 जुलाई 2013 dead Cd no KappTecZ High temperature, high strength solder that may be used on most metals, but works extremely well on Aluminum, Copper and Stainless Steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals. Above its liquidus of 600°F, this solder is extremely fluid and will penetrate the closest joints. 5 17 78 Sn40Zn27Cd33 176/260Kapp Alloy KappRad http://www.kappalloy.com/kapprad-solder.php Kapp Alloy & Wire, Inc 25 अक्टूबर 2012 https://www.webcitation.org/6I93flDS7?url=http://www.kappalloy.com/kapprad-solder.php 16 जुलाई 2013 dead Cd no KappRad Developed specifically to join and repair Aluminum and Aluminum/Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. 40 27 33 Zn90Cd10 265/399 Cd For soldering aluminium. Good wetting. 90 10 Zn60Cd40 265/335 Cd For soldering aluminium. Very good wetting. 60 40 Cd70Sn30 140/160 Cd no Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. 29.56 70.44 Sn50Pb32Cd18 145 Cd,Pb Cd18 50 32 18 Sn40Pb42Cd18 145Soft Solders https://web.archive.org/web/20120308145324/http://www.cupalloys.co.uk/soft-solders-c41.html 8 मार्च 2012 . www.cupalloys.co.uk (2009-01-20). Retrieved on 2010-07-06. Cd,Pb Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. 40 42 18 Zn70Sn30 199/376 – no For soldering aluminium. Excellent wetting. Good strength. 30 70 Zn60Sn40 199/341 – no For soldering aluminium. Good wetting. 40 60 Zn95Sn5 382 – yes? For soldering aluminium. Excellent wetting. 5 95 Sn90Au10 217http://www.matweb.com/search/DataSheet.aspx?MatGUID=ec6a4e98e2294ead8788107da410c9d8 Indalloy 238 Sn-Au Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819083349/http://www.matweb.com/search/DataSheet.aspx?MatGUID=ec6a4e98e2294ead8788107da410c9d8 19 अगस्त 2014 dead – yes 90 10 Au80Sn20 280 – yes Au80. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature.http://www.indium.com/_dynamo/download.php?docid=298 Gold Tin – The Unique Eutectic Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20110929033419/http://www.indium.com/_dynamo/download.php?docid=298 29 सितंबर 2011 dead Forms a mixture of two brittle intermetallic phases, AuSn and Au5Sn.http://www.chipscalereview.com/issues/1004/article.php?type=feature&article=f3 Chip Scale Review Magazine Chipscalereview.com 2004-04-20 2010-03-31 https://www.webcitation.org/6I93gPGLV?url=http://www.chipscalereview.com/issues/1004/article.php?type=feature 16 जुलाई 2013 dead Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability. Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150°C.http://www.indium.com/gold/files/2010/12/98217.pdf Indalloy 182 Gold-Tin Solder Paste. 19 जुलाई 2011 https://web.archive.org/web/20110719145615/http://www.indium.com/gold/files/2010/12/98217.pdf 19 जुलाई 2011 dead Good ductility. Also classified as a braze. 20 80 Au98Si2 370/800 – Au98. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow. 98 Si2 Au96.8Si3.2 370 363http://www.matweb.com/search/DataSheet.aspx?MatGUID=ac3061509fca4befa1191973be39cd62 Indalloy 184 Gold Solder Alloy 16 अगस्त 2014 https://web.archive.org/web/20140819102952/http://www.matweb.com/search/DataSheet.aspx?MatGUID=ac3061509fca4befa1191973be39cd62 19 अगस्त 2014 dead – yes Au97. AuSi3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation. 96.8 Si3.2 Au87.5Ge12.5 361 356 – yes Au88. Used for die attachment of some chips. The high temperature may be detrimental to the chips and limits reworkability. 87.5 Ge12.5 Au82In18 451/485 – no Au82. High-temperature, extremely hard, very stiff. 18 82 In100 157 – pure In99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures.http://books.google.com/?id=71tVjt0QUrEC&pg=PT27 Advanced Packaging May–Jun 2008 17 4 1065-0555 24 Choosing the best bumb for the buck T.Q. Collier Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron. 99.99 इन्हें भी देखें टाँका लगाना श्रेणी:मिश्रधातु