Microtechnology/Additive Processes

Additive Processes Processes where material is added to the wafer. Overview Oxidation Oxidation in microtechnology refers most often to the oxidation of silicon. A layer of silicon dioxide created on the surface of a silicon wafer can be easily patterned. An SiO2 layer can be created by thermal oxidation or by deposition. Chemical Vapor Deposition (CVD) Chemical vapor deposition and plasma enhanced CVD Physical Vapor Deposition (PVD) Physical vapor deposition (PVD) Sputter Deposition w:sputtering Thin-film deposition thumb|300px|Energetic ions sputter material off the target which diffuse through the plasma towards the substrate where it is deposited. There is no strong plasma glow around the cathode since it takes a certain distance for the plasma to be generated by electron avalanches started by a few secondary electrons from the sputtering process. Electron Beam Evaporation Coating Electron Beam Evaporation Coating Epitaxial Growth Metal Organic Vapor Phase Epitaxy (MOVPE) Molecular beam epitaxy (MBE) using solid sources and Chemical beam epitaxy (CBE) using gasseuos sources. Epitaxy in general. Atomic layer epitaxy where only a few monolayers are deposited and bond to chemisorption sites on the surface. Electrochemical Methods Electroplating Electroplating list of standard reaction potentials standard reduction potentials Electroless depositions Electroless nickel plating Electrochemical deposition of metals onto silicon Y. Okinaka, in Electroless Plating: Fundamentals and Applications, edited by Glenn O. Mallory and Juan B. Hajdu, Chapter 15, American Electroplaters and Surface Finishers Society (1990). Spinning Photo and electron beam resists as well as many other polymers are often coated on wafers by spinning a volatile solution of the compound onto the wafer. Surface Functionalization Self-assembled monolayers (SAM) Hydrophobe and Hydrophile surface layers to control wetting. References See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.