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Microtechnology/Lithography
Reference material by Wikibooks contributors. This retains its source identity and is not 411 news reporting.
Lithography
SPIE Handbook
Intro to lithography
Ultra Violet Lithography (UVL)
Photolithography
Photoresist
Masks for UVL
Various types of masks are in use for UVL:
Chrome-on glass maks for structures down to micron-resolution
Acetate masks for structures with minimum dimensions of tens of microns
Resists for UVL
Negative UVL resists
PMMA
SU-8
Positive UVL resists
Electron Beam Lithography (EBL)
Electron beam lithography offers linewidths down to the few nm range, much smaller than what can bea achieved by optical lithography. One drawback is that the pattern writing is a serial process and hence very time consuming for larger structures.
Resources on the net
SPIE Handbook of Microlithography, Micromachining and Microfabrication has an online chapter on EBL
What determines the EBL resolution
Beam diameter
Resist sensitivity
development method
Proximity effect
Resist thickness
Electron beam resists
Negative E-beam resists
negative e-beam resists will remain in the irradiated areas after development.
Electron beam induced deposition
PMMA
SU-8
Positive E-beam resists
Positive e-beam resists will be removed in the electron irradiation areas upon development.
PMMA
Typical PMMA process
300nm PMMA think film made by spinning 950k PMMA 5% in anisole at 5000rpm for 30sec (avoid bubbles in the resist when placing it on the wafer, use about 3ml for a 4" wafer).
drying 180C Hot plate for 2 min or oven bake for at least 2h at 180 C. Oven takes longer than hot plate as convection heat trasnfer is slower than contact transfer.
Electrob beam lithography. Dosage depends on pattern density and acceleration voltage.
Developing in MIBK:IPA (1:3) for 60s and rinse in IPA for 30s.
Post bake to improve etch resistance. 30 min at 110C
5 mBar Oxygen plasma in faraday cage for 20 sec to remove residual resist.
For instance metal evaporation to form metal structures, followed by liftoff 5 min in hot remover s-1165 and acetone in several fresh baths to remove liftoff fragments.
ZEP
Resist Coatings
Spinning
Electrochemical coating
Spray coating (Spray coaters are made by eg. EVG)
Drop casting
Self assembled monolayers
References
See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.