Microtechnology

The open source Handbook of Microfabrication and Microtechnology 25% The Wikibook on Microtechnology has been started with the intention to gather information in one place about the various applications, fabrication methods and systems to provide students, researchers and everyone else an open-source handbook and overview guide. 400pxMaterial is continuously being added to this book -join the effort to create it!Overview Tables: Wet Etches Microfabrication Materials Silicon Material Properties Semiconductor Electronic PropertiesEncourage the authors -use the discussion pageThere is a related book on Nanotechnology.Latest major addition: Semiconductor Electronic PropertiesGoogle Search in this book __NOTOC__ ContentsDetailed descriptions (100%-icons are individual web pages; Numbers are sub-sections)Part 1: INTRODUCTION What is microtechnology about - what can you use it for and where is it going?50% /Introduction/ A Perspective on Microtechnology Applications of Microtechnology 50% Overviews Internet Resources Journals Microtech Products & Companies A Micro-technology Timeline 50% About the Book Vision How to Contribute History Authors Support and Acknowledgements25% Reaching Out Outreach Projects Demonstration Experiments Teaching MicrotechnologyPart 2: MATERIALS Silicon is the traditional microfabrication material for making computer chips and other electronic circuits. A wealth of other material types are being increasingly used for lab-on-a-chip systems and cheap disposable circuits.25% /Materials/ Overview Applications and Uses Product Life-Cycles Environmental Considerations Wafers and Substrates Overview25% Semiconductors Silicon Polycrystalline Silicon IV Semiconductors III-V Semiconductors II-VI Semiconductors25% Insulators Silicon Dioxide Silicon Nitride PMMA PDMS SU825% Conductors Noble Metals Alloys SilicidesPart 3: FABRICATION PROCESSES Microfabrication is largely concerned with making microchips by batch processing silicon (and an increasing number of different materials) wafers into individual chips in a cleanroom facility. Cleanrooms are used because dust must be avoided. The parts of a microchip are much smaller than the average dust particle, and a single particle can wreak havoc in a sensitive process (not only making a fault at some point on the wafer, but also contaminating process equipment) The processes can roughly be divided into Additive and etching processes that wither add or remove material, and lithography that creates patterns on the surface.50% Additive Processes Overview Oxidation Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Epitaxial Growth Electrochemical Methods Spinning Surface Functionalization50% Etching Processes Etchants Wet Etch Overview Table Wet Etch Compatibility Chart Capillary Effects Silicon KOH Etch Silicon Oxide Etch (HF, BHF, BOE) Silicon Nitride Etch Metal Etches Cleaning Methods Dry Etching Overview Reactive Ion Etching (RIE, DRIE, ASE) Dry Cleaning Methods (Plasma, Ozone) Laser Ablation Gas Etches25% Lithography Ultra Violet Lithography (UVL) Electron Beam Lithography (EBL) Resist Coatings25% Additional Methods Rapid Thermal Anneal (RTA) Wafer Bonding Electrical Connections Doping Packaging Ellipsometry 4 Point Measurements Atomic Force Microscopy Scanning Electron Microscopy Optical Microscopy Vacuum EquipmentPart 4: APPLICATIONS Reading this, you are quite used to your computer which is based on microelectronics, you access the internet which would not work well without photonics. The airbag sensor in you car is a MEMS devices and shortly you will also find lab-on-a-chip devices in your everyday life.25% Microelectronics An Ohmic Resistor The Diode The Transistor CMOS25% Photonics Waveguides Photonic Band Gap Structures Electro-optical Devices50% Micro-electromechanical Systems (MEMS) Applications Resonators Strain Gauges Pressure Sensors AFM cantilevers Acceleration Detectors Optical Beam Control RF MEMS25% Microfluidics and Sensors Applications Microfluidic Pumps Microfluidic Valves Chemical Noses PCR Systems Microfluidic Cell Handling M Materials engineering 25%