Microtechnology/Additional Methods

Additional Methods Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them. Rapid Thermal Anneal (RTA) Rapid thermal anneal (RTA) Wafer Bonding Wafer bonding Direct bonding Plasma activated bonding Anodic bonding Eutectic bonding Glass frit bonding Adhesive bonding Thermocompression bonding Reactive bonding Wafer bond characterization Electrical Connections Doping Dopant Ion Implantation Ion Implantation Diffusion Doping Spin-on doping Packaging Interconnections Wire bonding Flip chip bonding Wedge bonding Using ZIF sockets Encapsulation Silicone oil Spray-on polymers Glues Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue. Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett. Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C Ellipsometry Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance). 4 Point Measurements The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes. Atomic Force Microscopy The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness. Scanning Electron Microscopy JEOL has a good guide to SEM image interpretation Optical Microscopy Theres a good introduction to optical microscopy from Zeiss. Vacuum Equipment mass flow controllers (MFC) Gas conversion factors and formulas for calculating them References See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.